Cammax Precima specialises in the design and manufacture of assembly equipment for adhesive and eutectic processes, in the production of integrated circuits, multi chip modules, microstructures, optoelectronic devices and sensors.
In recent years, we have maintained a significant profile within the telecommunications industry, offering a range of manual and semi-automatic die attach equipment, capable of bonding delicate devices (GaAs) to a placement accuracy of 5 microns.
From the outset, we have strived to work closely with our customers, to ensure our equipment meets the stringent demands of particular process requirements.
During our 18 year history we have sold equipment to major companies either directly through our network of agents, to countries such as Japan, China, Korea, Malaysia, USA and most countries within Europe.
We also work closely with many Universities worldwide, providing solutions to their particular R&D requirements